ROG Maximus XII series motherboards are designed to explore the upper echelons of gaming and overclocking.
The Formula is plumbed for custom liquid cooling and includes other enhancements to punctuate premium systems. The CrossChill EK III VRM block, co-developed with EK Water Blocks, help cope with higher VRM loads associated with Intel Comet Lake CPUs. Aesthetically, Maximus XII Formula has a stealthy black finish with intricate patterns cut into its reflective armor. The latest-generation Formula is all set to make your showcase rig shine.


 
Intelligent Motherboard
 
Our ROG engineers developed and extensively-tested intelligent software solutions to ensure your system stays in optimal condition.
 
AI Overclocking
Tuning is now faster and smarter than ever before. AI Overclocking profiles the CPU and cooling to predict the optimal configuration for each system.
 
AI Cooling
AI Cooling automatically manages and controls motherboard connected fans, ensuring the most efficient settings depending on the current system load and temperature.
 
AI Networking
GameFirst VI optimises and organises network bandwidth, effectively reducing jitter and eliminating spike lag to ensure smooth online gameplay.
 
 
 
 
 
 
 
Performance
 
The Intel Comet Lake processor features 10 cores and a peak single-core Turbo speed that exceeds 5.3 GHz right out of the box. To cope with this increased demand on the system, Maximus XII Formula takes advantage of its intelligent VRM design and uses quality components to ensure the best gaming and daily productive computing experience.
 
 
 
 
Power Solution
 
Teamed Power Architecture
Today's CPU architectures place incredible demands on motherboard power design by transitioning from deep power saving modes , going from lower-power mode to full load in an instant. Our latest VRM architecture rises to the challenge by utilising teamed power stages to rapidly swing current, while maintaining exemplary thermal performance.
 
 
 
 
 
Memory
 
ASUS Optimem III
Boasting proprietary memory trace layout tweaks that improve signal integrity and mitigate noise, ASUS OptiMem III is more compatible with 3600 MHz+ memory kits, allowing them to run at higher frequencies. You can opt to optimise memory for high frequency settings, or low latency settings. With higher capacity memory kits, OptiMem III enables you to run at maximum frequency, whereas other motherboards will trade off frequency for capacity. Stack Maximus XII Extreme with your favourite modules and maximise throughput of the new 10th Generation Intel Core Comet Lake-S processor for applications that demand massive bandwidth.
 
 
 
 
 
 
 
Cooling
 
The focus on maximizing performance would be futile without similar dedication to improving the cooling that allows systems to sustain faster speeds. The CrossChill EK III VRM block enables Maximus XII Formula to cope with the high VRM loads of ten core CPUs. The hybrid cooling system sits atop of a heatpipe that's directly linked to the extended VRM heatsink, giving it cooling capabilities that surpass the requirements of this current generation.
 
 
 
 
 
CrossChill EK III
 
CrossChill EK III lets you cool with air and water. The redesigned copper cooling channel is wider to provide up to 37.2C-lower MOSFET temperatures on water, while the standard G1/4" threaded fittings allow it to fit existing setups for efficient, quiet cooling with minimum effort.
 
 
 
 
 
Heatsinks
 
CrossChill hybrid thermal design
Engineered with a copper cooling channel that's incredibly effective at removing heat
 
Large-diameter heatpipe
The U-shaped design provides rapid and even heat transfer from the VRM to the extended VRM heatsink.
 
M.2 heatsink
A dedicated heatsink keeps the two M.2 SSDs at the optimum operating temperature for consistent performance and reliability.
 
High-conductivity thermal pad
The high-quality thermal pad improves overall heat transfer from the system by bridging the heat generated by the power stages to the heatsink.
 
Extended VRM heatsink
The extended heatsink at the end of heatpipe increases thermal mass to offset the additional heat generated by high power consumption.
 
Chipset heatsink
A dedicated chipset heatsink draws heat away to maintain optimum operating temperatures.
 
Solid steel backplate
An electro-galvanized, cold-rolled coil construction backplate resists bending, and helps draw heat away from the VRM.
 
 
 
 
Headers
 
Cooler by Design
ROG Maximus XII Formula features the most comprehensive cooling options ever.
 
Multiple temperature sources
Each header can be set to monitor and react to three user-configurable thermal sensors for workload-based cooling. And all settings can be easily managed by Fan Xpert 4 or UEFI.
 
4-pin PWM/DC fan
Every onboard header supports auto-detection of PWM or DC fans.
 
AIO pump
A dedicated PWM/DC header for self-contained water-cooling setups.
 
 
 
 
 
ROG Water-Cooling Zone
 
Dual water-temperature headers and a flow-rate header feed information straight into the AI Suite utility, allowing you to track coolant temperatures and the flow rate of the entire loop.
 
Water pump+
A dedicated header can supply over 3 amps to high-performance PWM or DC water pumps.
 
Water in/out
A dedicated header enables monitoring of temperatures at the input/output points of any component.
 
Water flow
A dedicated header enables constant monitoring of flow rate throughout the entire loop.
 
 
 
 
 
 
 
Optimisastion 
 
Maximus XII Formula is packed with intuitive and flexible tools to allow customization across all system parameters to deliver the performance you want.
 
 
 
 
 
Accurate Voltage Monitoring
 
Conventional motherboards use single-ended sensing tapped from a location that isn't ideal, leading to a large disparity between the actual voltage fed to the CPU and the value reported to software. Maximus XII Formula features a differential-sensing circuit and delicate IC that simplify overclocking and tuning by allowing you to track voltages more accurately.